无铅松香芯焊锡丝中新型助焊剂的研制

通过扩展率实验对松香芯焊锡丝用助焊剂的成分及配比进行选择及优化,然后通过添加一种天然植物油(C油)对该优化过的助焊剂进行进一步改进,依据行业标准对制备的助焊剂进行了测试。结果表明,这款助焊剂不含卤素、无腐蚀性、表面绝缘电阻高(1.68×10~(11)Ω);无铅SnCu焊锡丝在使用这款助焊剂时,焊接效果好,松香飞溅值为0.3%,扩展率为75.9%。

Development of a new kind of flux for lead-free rosin-core solder wire

Through performing the spread rate measurements, components were selected and composition was optimized for the flux used for lead-free rosin-core solder wires. And, a kind of natural vegetable oil (C oil) was added to the optimized flux to further improve the flux performance. The performance of the prepared flux was evaluated according to the corresponding standards. The results show that the prepared flux is halogen-free and exhibits weak corrosiveness and high surface insulation resistance (1.68×1011 ?). When the flux is used, lead-free rosin-core SnCu solder wires show excellent soldering performance, small rosin splashing value of 0.3% and large spread rate of 75.9%.