Submicron polymer structures with X-ray lithography and hot embossing |
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Authors: | Timo Mappes Matthias Worgull Mathias Heckele Jürgen Mohr |
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Affiliation: | 1. Institut für Mikrostrukturtechnik (IMT), Universit?t Karlsruhe, Kaiserstrasse 12, 76131, Karlsruhe, Germany 2. Institut für Mikrostrukturtechnik (IMT), Forschungszentrum Karlsruhe GmbH, P.O. Box 3640, 76021, Karlsruhe, Germany
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Abstract: | This article describes the process chain for replication of submicron structures with varying aspect ratios (AR) up to 6 in polymethylmethacrylate (PMMA) by hot embossing to show the capability of the entire LIGA process to fabricate structures with these dimensions. Therefore a 4.7 μm thick layer of MicroChem 950k PMMA A11 resist was spin-coated on a 2.3 μm Ti/TiO x membrane. It was patterned with X-ray lithography at the electron storage ring ANKA (2.5 GeV and λ c ≈ 0.4 nm) at a dose of 4 kJ/cm3 using a Si3N4 membrane mask with 2 μm thick gold-absorbers. The samples were developed in GG/BDG and resulted in AR of 6–14. Subsequent nickel plating at 52°C resulted in a 200 μm thick nickel tool of 100 mm diameter, which was used to replicate slit-nozzles and columns in PMMA. Closely packed submicron cavities with AR 6 in the nickel shim were filled to 60% during hot embossing. |
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