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Submicron-scale surface acoustic wave resonators fabricated by high aspect ratio X-ray lithography and aluminum lift-off |
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| Authors: | Sven Achenbach David Klymyshyn Timo Mappes Anton Kachayev Venkat Subramanian Garth Wells Jürgen Mohr |
| Affiliation: | 1. Department of Electrical and Computer Engineering, University of Saskatchewan, 57 Campus Drive, S7N 5A9, Saskatoon, Saskatchewan, Canada 2. Institut für Mikrostrukturtechnik (IMT), Forschungszentrum Karlsruhe, Postfach 3640, 76021, Karlsruhe, Germany 3. TRLabs, 111-116 Research Drive, S7N 3R3, Saskatoon, Saskatchewan, Canada 4. Institut für Mikrostrukturtechnik (IMT), Universit?t Karlsruhe, Kaiserstrasse 12, 76131, Karlsruhe, Germany 5. Vecima Networks, 150 Cardinal Place, S7L 6H7, Saskatoon, Saskatchewan, Canada |
| Abstract: | A submicron-scale surface acoustic wave (SAW) resonator fabricated by high-aspect-ratio X-ray lithography (XRL) and metal lift-off that operates at microwave frequencies is presented. We demonstrate that XRL is especially well suited for SAW device templating, as long submicron-scale interdigitated transducer structures can be batch patterned with excellent structure quality. 0.4–2.0 μm thick PMMA layers were structured by X-ray lithography shadow projection using silicon nitride-based X-ray masks. Structures with a critical lateral feature size of down to 200–700 nm were processed. The polymer structures served as templates in a subsequent aluminum lift-off process. The metal electrodes were successfully tested as SAW resonators for high frequency applications, e.g. around 1.3 GHz, using calibrated 1-port RF wafer probing measurements. Compared with standard fabrication techniques, the high structure quality of submicron-scale polymer templates made of unusually thick PMMA layers offers additional possibilities to fabricate thicker metal transducers. |
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