首页 | 本学科首页   官方微博 | 高级检索  
     

制备工艺对智能框架断路器用AgNi(30)C(3)触头材料性能的影响
引用本文:张秀芳,鲁香粉,方耀兴,柏小平,黄文明,黄钟. 制备工艺对智能框架断路器用AgNi(30)C(3)触头材料性能的影响[J]. 电工材料, 2011, 0(4): 23-26
作者姓名:张秀芳  鲁香粉  方耀兴  柏小平  黄文明  黄钟
作者单位:福达合金材料股份有限公司,浙江温州,325025
摘    要:分别采用机械混粉法和化学包覆法制备AgNi(30)C(3)粉体,分析了不同制备工艺条件下AgNi(30)c(3)触头材料显微组织和性能的变化。结果表明,化学包覆法制备的AgNi(30)C(3)材料颗粒细小,分散均匀,基体结合强度较高。与机械混粉法制备的AgNi(30)C(3)相比,化学包覆法制备的AgNi(30)C(3)材料密度、硬度较高,电阻率较低,综合性能较佳。

关 键 词:AgNi(30)C(3)触头材料  混粉  包覆  智能框架断路器

Effect of Different Technologies on the Properties of AgNi(30)C(3) Contact Material Used in Intelligent Air Circuit Breakers
ZHANG Xiu-fang,LU Xiang-fen,FANG Yao-xing,BAI Xiao-ping,HUANG Wen-ming,HUANG Zhong. Effect of Different Technologies on the Properties of AgNi(30)C(3) Contact Material Used in Intelligent Air Circuit Breakers[J]. Electrical Engineering Materials, 2011, 0(4): 23-26
Authors:ZHANG Xiu-fang  LU Xiang-fen  FANG Yao-xing  BAI Xiao-ping  HUANG Wen-ming  HUANG Zhong
Affiliation:ZHANG Xiu-fang,LU Xiang-fen,FANG Yao-xing,BAI Xiao-ping,HUANG Wen-ming,HUANG Zhong(Fuda Alloy Materials Co.Ltd.,Zhejiang Wenzhou 325025,China)
Abstract:In this paper,AgNi(30)C(3) powder was prepared by powder-mixing and coating methods.Microstructures and properties of AgNi(30)C(3) fabricated by differet technologies were studied.The results show that a more uniform microstructure and a higher bonding strength were obtained when prepared by coating method.Compared to powder-mixing process,AgNi(30)C(3) contact material with higher density and hardness,lower electric resistivity was fabricated by coating process.
Keywords:AgNi(30)C(3) contact material  powder-mixing  coating  intelligent air circuit breakers  
本文献已被 CNKI 维普 万方数据 等数据库收录!
设为首页 | 免责声明 | 关于勤云 | 加入收藏

Copyright©北京勤云科技发展有限公司  京ICP备09084417号