基于信号完整性的高速PCB优化设计与研究

印制电路板（Printed Circuit Board，PCB）设计者因缺少PCB制造经验而难以系统、全面和创造性地考虑高速电路的信号完整性问题，本文运用信号完整性相关理论知识全面分析和解决高速PCB设计过程中遇到的问题.以高速PCB的设计和制造为例，利用信号完整性分析方法将地层铜桥、差分线和导通孔设计与高速电路的特征和实际制造工艺相结合，创造性地把外层差分微带线通过盲孔转移到内层带状线，找到优化设计的解决方案.实例显示，把信号完整性分析与高速PCB可制造性相结合，能够有效地解决高速PCB的信号失真问题，一定程度上优化了高速电路的设计及缩短了产品的开发周期.

Research and Optimization Design of High-speed PCB Based on Signal Integrity

Due to the lack of the PCB (Printed Circuit Board) manufacturing experience, it is difficult for designers to consider the problem of signal integrity for high-speed PCB systematically, comprehensively and innovatively. The theory of signal integrity is used to comprehensively analyze the contradictions encountered in the design process, so as to solve the contradictory problems more effectively. Taking the problems encountered in PCB design and fabrication as examples, the method of signal integrity analysis is used to combine the design of copper bridge, differential trace and via holes with the feature of high-speed circuit and manufacturing process, and optimal solution is obtained by the extension innovation of transferring the differential traces from external layer micro-strip to the internal layer strip-line by blind holes. From the examples, it can be found that the signal distortion problem of high-speed PCB can be effectively solved by combining signal integrity analysis and design of manufacturing, and thus the high-speed circuit design and product development cycle is greatly optimized.