双向光收发组件探测器端耦合和封装工艺分析

探测器响应度直接影响双向光收发组件(bi-directional optical sub-assembly,BOSA)的性能,探测器端的耦合和封装在BOSA生产中占据重要地位。为了系统分析BOSA生产中各偏移因素对探测器端耦合的影响,选择探测器电流响应度作为耦合标准进行实验,并通过分析实验结果来得出BOSA探测器端耦合和封装过程中的改进措施。参考BOSA的实际光路,建立光纤-波片-芯片耦合模型,模拟了光束偏移与耦合效率的关系;研究了BOSA耦合和封装工艺中产生的偏移,并分析它们对探测器端耦合效率的影响。随后使用自动耦合设备,对BOSA探测器端进行耦合实验,并分析波片角度偏移、波片与探测器透镜的高度差、探测器透镜水平偏移对耦合效率的影响。实验结果表明:探测器透镜水平偏移对耦合效率的影响最大,波片角度偏移、波片与探测器透镜的高度差对耦合效率的影响较小。研究结果为BOSA探测器端的耦合和封装提供了系统的理论指导,对BOSA的实际生产有一定参考价值。

Analysis of coupling and packaging process for photodiode of bi-directional optical sub-assembly

Responsivity of photodiode directly affects the performance of the bi-directional optical sub-assembly (BOSA), and the coupling and packaging of the photodiode play an important role in production. In order to systematically analyze the influence of various offset factors of BOSA on the coupling of the photodiode, the photodiode current responsivity was selected as the coupling standard for experiment, and the improvement measures in the coupling and packaging process of the BOSA photodiode were obtained through the analysis of the experimental results. Referring to the actual optical path of BOSA, a fiber-filter-chip coupling model was established to simulate the relationship between beam offset and coupling efficiency. The offset generated in the BOSA coupling and packaging was studied and its effect on the coupling efficiency of the photodiode was analyzed. The coupling experiment was then performed on the BOSA photodiode using an automatic coupling device. The effects of the angular offset of filter, the height difference of filter-photodiode lens and the horizontal offset of photodiode lens on the coupling efficiency were analyzed. The experimental results showed that the horizontal offset of photodiode lens had the greatest influence on the coupling efficiency, and the angular offset of filter and the height difference of the filter-photodiode lens had little effect on the coupling efficiency. The research results provide systematic theoretical guidance for the coupling and packaging of BOSA photodiode, which has reference value for actual production.