MEMS器件平板运动结构的空气阻尼分析

为保证常压封装的MEMS器件有期望的动态特性,需分析微结构的空气阻尼效应.采用ANSYS对运动板间空气阻尼进行了仿真分析.建立了压膜阻尼模型,利用稳态分析和谐波分析分别确定低频和高频工作时的阻尼效应,分析了运动板工作频率、速度、材料适应系数与空气阻尼的关系,并把无孔板和有孔板的阻尼进行了对比分析.结果表明:工作频率和结构参数是影响空气阻尼的重要因素,在板上开孔可控制阻尼系数和刚度系数.

Analysis on Air Damping of Plate Movement in MEMS Devices Based on Finite Element

Squeeze film damping is critical in microstructures where the damping and stiffening effects of thin layers of air can significantly affect the behavior of devices.ANSYS thin film analysis is adopted to simulate the effects of squeeze film damping.Static analysis and harmonic response analysis method are respectively used for low operating frequencies and high operating frequencies,accordingly,the dependences of squeeze-film air damping on operating frequency,velocity,and material accommodation factor are analyzed.Moreover,pressure distribution of damping effect in plate gap under two conditions,with perforated holes and without holes,is determined and compared.Simulation results show that operating frequency and the structure of microstructures are the main influencing factors to air damping and perforated holes in plate gap can control stiffness coefficients of squeezed film damping.