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Electrodeposition of Indium Bumps for Ultrafine Pitch Interconnection |
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| Authors: | Yingtao Tian Changqing Liu David Hutt Bob Stevens |
| Affiliation: | 1. Wolfson School of Mechanical and Manufacturing Engineering, Loughborough University, Loughborough, Leicestershire, LE11 3TU, UK 2. School of Electronic, Electrical and Computer Engineering, University of Birmingham, Edgbaston, Birmingham, B15 2TT, UK 3. iSMART, School of Science and Technology, Nottingham Trent University, Clifton Campus, Nottingham, NG11 8NS, UK |
| Abstract: | Electroplating is a promising method to produce ultrafine pitch indium bumps for assembly of pixel detectors in imaging applications. In this work, the process of indium bumping through electrodeposition was demonstrated and the influences of various current waveforms on the bump morphology, microstructure and height uniformity were investigated. Electron microscopy was used to study the microstructure of electroplated indium bumps and a Zygo white light interferometer was utilised to evaluate the height uniformity. The results indicated that the bump uniformities on wafer, pattern and feature scales were improved by using unipolar pulse and bipolar pulse reverse current waveforms. |
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