Interface nanochemistry effects on stainless steel diffusion bonding |
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Authors: | M J Cox R W Carpenter M J Kim |
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Affiliation: | (1) the Center for Solid State Science, Science and Engineering of Materials, Arizona State University, 85287-1704 Tempe, AZ;(2) the Department of Materials Science, University of North Texas, 76203 Denton, TX |
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Abstract: | The diffusion-bonding behavior of single-phase austenitic stainless steel depends strongly on the chemistry of the surfaces
to be bounded. We found that very smooth (0.5 nm root-mean-square (RMS) roughness), mechanically polished and lapped substrates
would bond completely in ultrahigh vacuum (UHV) in 1 hour at 1000 °C under 3.5 MPa uniaxial pressure, if the native oxide
on the substrates was removed by ion-beam cleaning, as shown by in-situ Auger analysis. No voids were observed in these bonded interfaces by transmission electron microscopy (TEM), and the strength
was equal to that of the unbounded bare material. No bond formed between the substrates if in-situ ion cleaning was not used. The rougher cleaned substrates partially bonded, indicating that roughness, as well as native
oxides, reduced the bonding kinetics. |
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