| 导电胶粘剂的研究进展 |
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| 引用本文： | 刘欣盈,向雄志,白晓军. 导电胶粘剂的研究进展[J]. 电子元件与材料, 2013, 32(3): 13-17 |
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| 作者姓名： | 刘欣盈 向雄志 白晓军 |
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| 作者单位： | 深圳大学材料学院,广东深圳,518060 |
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| 基金项目： | 广东高校优秀青年创新人才培养计划资助项目 |
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| 摘 要： | 随着微电子技术的发展以及环保意识的增强,作为Pb/Sn焊料替代物的导电胶粘剂,已成为当前研究的热点和重点。介绍了导电胶粘剂的导电机理及其组成、功能和分类。重点概述了近年来国内外导电胶粘剂的研究现状,并展望了未来导电胶粘剂的研究方向。
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| 关 键 词： | 导电胶粘剂 导电机理 综述 导电率 分类 导电填料 发展方向 |
Research progress of electrically conductive adhesives |
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| LIU Xinying,XIANG Xiongzhi,BAI Xiaojun. Research progress of electrically conductive adhesives[J]. Electronic Components & Materials, 2013, 32(3): 13-17 |
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| Authors: | LIU Xinying XIANG Xiongzhi BAI Xiaojun |
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| Affiliation: | (College of Materials Science and Engineering,Shenzhen University,Shenzhen 518060,Guangdong Province,China) |
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| Abstract: | With the development of micro-electronics technology and the enhance for awareness of environmental protection,electrically conductive adhesive,as the substitution of Pb/Sn solder,becomes a hot and key point of recent research.The conductive mechanism of electrically conductive adhesive and its composition,function and classification are introduced.The research status on the electrically conductive adhesive at home and abroad in recent years are mainly summarized,as well as the prospect of the future research direction. |
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| Keywords: | electrically conductive adhesive conductive mechanism review electric conductivity classification conductive filler development direction |
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