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可伐合金与玻璃一步封接工艺的研究
引用本文:罗大为,李雪,赵治亚,沈卓身.可伐合金与玻璃一步封接工艺的研究[J].电子元件与材料,2013,32(5):52-55.
作者姓名:罗大为  李雪  赵治亚  沈卓身
作者单位:1. 深圳职业技术学院化生学院,广东深圳,518055
2. 深圳光启高等理工研究院深圳超材料制备与封装技术重点实验室,广东深圳,518000
3. 北京科技大学材料科学与工程学院,北京,100083
基金项目:深圳市科工贸委资助项目,广东省战略新兴产业核心攻关资助项目,省部产学研结合资助项目
摘    要:研究了玻璃与具有Fe3O4氧化膜的可伐合金的封接工艺。结果表明最佳熔封温度为980℃,熔封时间为30 min。在此基础上,开发出将脱碳、氧化和熔封集于一个升降温周期的一步封接工艺。该工艺是将未氧化的可伐合金和玻坯首先升温至500℃并氧化40 min,而后升温至980℃并保温30 min,最后缓慢降至室温。结果表明,当采用该工艺时,与传统工艺相比不仅能简化操作,而且封接件的封接质量更高、可靠性更好。

关 键 词:可伐合金  玻璃  封接  Fe3O4氧化膜  气密封接  爬坡高度  结合强度

Research of one-step sealing process for glass to Kovar alloy
LUO Dawei,LI Xue,ZHAO Zhiya,SHEN Zhuoshen.Research of one-step sealing process for glass to Kovar alloy[J].Electronic Components & Materials,2013,32(5):52-55.
Authors:LUO Dawei  LI Xue  ZHAO Zhiya  SHEN Zhuoshen
Affiliation:1.School of Applied Chemistry and Biotechnology,Shenzhen Polytechnic,Shenzhen 518055,Guangdong Province,China;2.Shenzhen Key Laboratory of Metamaterial Fabrication and Packing,Shenzhen Kuang-Chi Institute of Advanced Technology,Shenzhen 518055,Guangdong Province,China;3.School of Materials Science and Engineering,University of Science and Technology Beijing,Beijing 100083,China)
Abstract:The sealing process of glass to Kovar with Fe3O4oxidation film was investigated.The results indicate that the optimization sealing temperature is about 980 ℃ and the fusing sealing time is 30 min.On this basis,the one-step sealing process was developed which included decarburization,oxidation and sealing in a cycle of heating and cooling.In this process,un-oxidized Kovar and glass slab were firstly heated to 500 ℃ for 40 min,then heated to 980 ℃ for 30 min,then slowly cooled to room temperature.The results show that this process is more simplified than that of traditional process,and the reliability and quality are better than that of traditional process.
Keywords:Kovar alloy  glass  sealing  Fe3O4oxidation film  gas seal  height of glass along pin  bonding strength
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