| Effects of cooling rates on microstructure and microhardness of lead-flee Sn-3.5%Ag solders |
| |
| 引用本文： | 沈骏 刘永长 韩雅静 高后秀 韦晨 杨渝钦. Effects of cooling rates on microstructure and microhardness of lead-flee Sn-3.5%Ag solders[J]. 中国有色金属学会会刊, 2006, 16(1): 59-64. DOI: 10.1016/S1003-6326(06)60011-3 |
| |
| 作者姓名： | 沈骏 刘永长 韩雅静 高后秀 韦晨 杨渝钦 |
| |
| 作者单位： | College of Materials Science and Engineering, Tianjin University, Tianjin 300072, China |
| |
| 基金项目： | Foundation item： Project（50401033） supported by the National Natural Science Foundation of China; Project（200335） supported by the Foundation for the Author of National Excellent Doctoral Dissertation of China; Project（033608811） supported by the Natural Science Foundation of Tianjin City, China; Project supported by the Scientific Research Foundation for the Returned 0verseas Chinese Scholars, State Education Ministry |
| |
| 摘 要： | The microstructure and microhardness of Sn-3.5%Ag solders were explored in the cooling rate ranging from 0.08 to 10^4 K/s. Under rapid cooling condition, the strong kinetic undercooling effect leads to the actual solidification process starting at the temperature lower than the equilibrium eutectic point, and the actual metastable eutectic point shifts to the higher Ag concentration. Hence, the higher the applied cooling rate is, the more the volume fraction of primary β-Sn crystal forms. At the same time, the separation of primary β-Sn crystal favors restraining the formation of bulk Ag3Sn intermetallic compounds （IMCs） in solder due to the mismatch crystalline orientation relationship, those Ag3Sn phase separating through the eutectic reaction could hardly cling to the primary β-Sn crystal and grow up. Additionally, the Vickers hardness test shows that free β-Sn and spherical Ag3Sn phase in the rapidly solidified alloy strongly improves the microhardness of the Sn-3.5%Ag solder.
|
| 关 键 词： | 显微硬度 无铅焊料 Sn-3.5%Ag合金 共晶转变 金属间化合物 冷却速率 显微结构 |
| 收稿时间： | 2005-05-08 |
| 修稿时间： | 2005-09-22 |
Effects of cooling rates on microstructure and microhardness of lead-free Sn-3.5% Ag solders |
| |
| Jun SHEN, Yong-chang LIU, Ya-jing HAN, Hou-xiu GAO, Chen WEI,Yu-qin YANG. Effects of cooling rates on microstructure and microhardness of lead-free Sn-3.5% Ag solders[J]. Transactions of Nonferrous Metals Society of China, 2006, 16(1): 59-64. DOI: 10.1016/S1003-6326(06)60011-3 |
| |
| Authors: | Jun SHEN Yong-chang LIU Ya-jing HAN Hou-xiu GAO Chen WEI Yu-qin YANG |
| |
| Affiliation: | College of Materials Science and Engineering, Tianjin University, Tianjin 300072, China |
| |
| Abstract: | |
| |
| Keywords: | lead-free solder Sn-3.5%Ag solder eutectic reaction intermetallic compounds microhardness |
| 本文献已被 维普 ScienceDirect 等数据库收录！ |
