晶圆激光切割技术的研究进展

综述了半导体领域晶圆切割技术的发展进程,介绍了刀片切割技术、传统激光切割技术、新型激光切割技术及整形激光切割技术的特点、工作原理和优缺点以及国内外使用晶圆切割技术获得的研究成果及其应用前景.与刀片切割技术相比,激光切割技术具有切割质量好、切割速度快等优点.详细介绍了以进一步改善晶圆切割质量和提高切割速度为目的的几类整形激光切割技术,包括微水导激光切割技术、隐形切割技术、多焦点光束切割、“线聚焦”切割、平顶光束切割和多光束切割等.随着技术的不断完善、切割设备的不断成熟,整形激光切割技术在未来的晶圆切割领域将具有广阔的应用前景.

Research Progress on Wafer Laser Cutting Technology

The development process of the wafer cutting technology in semiconductor field is summarized.The characteristics,working principles,advantages and disadvantages of some cutting technologies are introduced,such as blade cutting technology,traditional laser cutting technology,new laser cutting technology and shaping laser cutting technology.The research results obtained by using the wafer cutting technology at home and abroad and its application prospects are also introduced.Comparing with the blade cutting technology,the laser cutting technology has the advantages of good cutting quality and fast cutting speed and so on.Several types of shaping laser cutting techniques,including micro-water guided laser cutting technology,stealth cutting technology,multifocal beam cutting,"line focusing"cutting,flat-top beam cutting and muhi-beam cutting to further improve the quality of wafer cutting and the cutting speed are introduced in detail.With the continuous improvement of technology and cutting equipment,shaping laser cutting technology will have a broad application prospect in the future wafer cutting field.