| 无机添加剂对低温共烧用表面金导体的影响 |
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| 引用本文： | 金勿毁,吕 刚,陈立桥. 无机添加剂对低温共烧用表面金导体的影响[J]. 贵金属, 2015, 36(4): 15-20 |
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| 作者姓名： | 金勿毁 吕 刚 陈立桥 |
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| 作者单位： | 昆明贵金属研究所 稀贵金属综合利用新技术国家重点实验室，昆明 650106,昆明贵金属研究所 稀贵金属综合利用新技术国家重点实验室，昆明 650106,昆明贵金属研究所 稀贵金属综合利用新技术国家重点实验室，昆明 650106 |
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| 基金项目： | 云南省科技厅 国际科技合作项目(2015IA035)、云南省发改委战略新兴产业发展专项([2015]1261)、国家基金委 地区科学基金(2012BAE06B05)。 |
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| 摘 要： | 金系导体低温共烧陶瓷(LTCC)技术为一些用于恶劣环境中的器件提供了高可靠性。当金厚膜导体与瓷料共烧时，无机添加剂可以和LTCC瓷料反应实现附着，但是在烧结过程中可能会发生起泡和烧结收缩失配，影响金导体的导电和焊接性能。本文针对金导体中的玻璃和无机物对金导体层和LTCC瓷料反应的影响做了综合性的研究，初步确定金导体层和瓷料的最佳烧结行为，为制备具有良好烧结匹配性、表面缺陷少、有良好附着力和键合性能的金导体浆料提供了一定参考。
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| 关 键 词： | 低温共烧陶瓷；厚膜金导体；附着力；气泡；烧结收缩率；键合 |
| 收稿时间： | 2015-03-31 |
The Effect of Inorganic Additives on the Performance of Co-Fired Surface Gold Conductors for LTCC Applications |
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| Affiliation: | State Key Laboratory of Advanced Technologies for Comprehensive Utilization of Platinum Metals,Kunming Institute of Precious Metal, Kunming 650106, China,State Key Laboratory of Advanced Technologies for Comprehensive Utilization of Platinum Metals,Kunming Institute of Precious Metal, Kunming 650106, China and State Key Laboratory of Advanced Technologies for Comprehensive Utilization of Platinum Metals,Kunming Institute of Precious Metal, Kunming 650106, China |
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| Abstract: | Low temperature co-fired ceramic (LTCC) with gold conductors offers both a high system reliability and excellent performance for applications in harsh environmental conditions. When the gold metallization is co-fired with the LTCC tape, inorganic additives in the gold conductor will interact with the LTCC tape, and the reaction product, acting as a binding phase, is essential to provide adequate adhesion for the gold metallization to the substrate. However, the product may migrate to the surface of the gold conductor, adversely affecting its bond performance. The present study focused on the interaction between inorganic additives and the LTCC tape with an attempt to optimize the sintering procedure as well as to provide experimental data for preparing excellent gold conductors for LTCC applications. |
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| Keywords: | LTCC gold thick film conductor adhesion blister sintering shrinkage wire bond |
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