| 集成电路封装线系统性静电防护 |
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| 引用本文： | 马国荣,丁荣峥,李欣燕.集成电路封装线系统性静电防护[J].电子与封装,2013(4):1-5. |
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| 作者姓名： | 马国荣 丁荣峥 李欣燕 |
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| 作者单位： | 1. 三江学院,南京,210012
2. 中国电子科技集团公司第58研究所,江苏无锡,214035 |
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| 摘 要： | 文中分析了静电产生的原因、电路静电损伤机理及失效机制。制定了集成电路封装线系统性静电防护措施。其涉及到封装厂房环境静电防护、封装生产设备静电防护、工艺操作静电防护、电路包装和运输过程中的静电防护以及静电防护检测等多个环节。对这些环节的全面控制有利于消除静电对集成电路的损伤。
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| 关 键 词： | 静电防护 静电损伤 集成电路封装 |
Systemic Electrostatic Protection of IC Packaging Line |
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| MA Guorong
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DING Rongzheng
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LI Xinyan.Systemic Electrostatic Protection of IC Packaging Line[J].Electronics & Packaging,2013(4):1-5. |
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| Authors: | MA Guorong DING Rongzheng LI Xinyan |
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| Affiliation: | 1.SanJiang College,Nanjing 210012,China;2.China Electronics Technology Group Corporation No.58 Research Institute,Wuxi 214035,China) |
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| Abstract: | The mechanism how static appears,damages and causes failure to ICs are analysed.Comprehensive and systematic static-proof plans are set down for IC packaging line.These plans are about electrostatic protection to plant's environment,electrostatic protection to equipments,electrostatic protection to operation,electrostatic protection to packing & transportation and the check of static.Control of all of these is able to eliminate damage to ICs by static. |
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| Keywords: | electrostatic protection electrostatic damage integrated circuit packaging |
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