| 超支化聚苯基硅树脂改性封装用环氧树脂研究 |
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| 引用本文： | 李良海,葛秋玲,李宗亚. 超支化聚苯基硅树脂改性封装用环氧树脂研究[J]. 电子与封装, 2013, 0(7): 1-4,11 |
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| 作者姓名： | 李良海 葛秋玲 李宗亚 |
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| 作者单位： | 无锡中微高科电子有限公司,江苏无锡,214035 |
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| 摘 要： | 文中通过合成超支化的聚苯基硅树脂体系,对环氧树脂进行改性,以提升其介电、耐湿、耐热和力学性能。研究表明,超支化聚苯基硅树脂体系（HBPSi）的加入量在0~10wt%时,改性后的树脂体系介电、耐湿、耐热和力学性能随着HBPSi增加而提升;而在大于10wt%时,其性能的提升减缓。产生这种结果主要归因于一方面HBPSi与EP中的羟基反应,消耗了环氧树脂体系的羟基,另一方面是引入了大量的柔性硅氧链节。
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| 关 键 词： | 环氧树脂 有机硅树脂 改性 封装材料 |
Research of Hyper Branched Polyphenyl Silicone Resin Modified Epoxy for Electronic Packaging |
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| LI Lianghai , GE Qiuling , LI Zongya. Research of Hyper Branched Polyphenyl Silicone Resin Modified Epoxy for Electronic Packaging[J]. Electronics & Packaging, 2013, 0(7): 1-4,11 |
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| Authors: | LI Lianghai GE Qiuling LI Zongya |
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| Affiliation: | (Wuxi Zhongwei High-tech Electronics Co.,Ltd,Wuxi 214035,China) |
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| Abstract: | In this paper,a novel hyperbranched phenyl silicone resin（HBPSi）was prepared,which was used to modify Epoxy resin（EP）.Tests results showed that when the contents of HBPSi were in the range of 0~10wt%,modified EP presents better properties as contents raise more;when the contents were more than 10wt%,properties of Epoxy resin increased slowly.This result is mainly attributed to the reaction of HBPSi and hydroxyl of EP,at the same time,Number of silicon-oxygen chains were grafted to the EP. |
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| Keywords: | epoxy resin silicone resin modify packaging materials |
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