陶瓷封装过程中的静电防护

半导体器件制造过程中的静电防护是十分重要的。文章从静电放电的模式出发,结合封装制造过程实际情况,列举了静电防护的各种措施。从材料、设备、设施等各方面提供有效的静电防护和安全的静电放电通道。随着半导体器件的高密度化以及为满足更多静电敏感器件的需要,传统的静电防护措施能力已经远远不够,还须对更多静电防护的细节进行改进提升。同时结合生产过程中的静电失效情况,在分析过程中找出失效源,进而在设备、材料上进一步提升整个静电防护系统的能力,为有效降低器件所受的静电损伤提供有力的保障。

ESD Protect in Process of Ceramic Package Assembly

It’s very important that ESD protection in manufacturing process for semiconductor device.The article lists various measurements for ESD protecting,according to electrostatic discharge model and base on actual manufacturing process.An effective ESD protecting method and a secure electrostatic discharge passageway is provided from raw material,equipment and facility.Due to higher density and more sensitive or ESD of semiconductor parts,it’s not effective by using the traditional ESD protecting,so improvement for ESD protecting must be done in more electrostatic discharge details.Base on ESD failure in manufacturing process,root cause shall be found by analysis,in order to promote the ability in total ESD protecting system at field of equipments and materials.So powerful and effective protection could be provided to reduce the electrostatic damage on device.