| 应力对Ag颗粒增强SnCu基复合钎料蠕变性能的影响 |
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| 引用本文： | 闫焉服,徐健,郭晓晓,冯丽芳,赵培峰.应力对Ag颗粒增强SnCu基复合钎料蠕变性能的影响[J].材料研究学报,2009,23(1):69-72. |
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| 作者姓名： | 闫焉服 徐健 郭晓晓 冯丽芳 赵培峰 |
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| 作者单位： | 1. 河南省有色金属材料科学与加工技术重点实验室,洛阳,471003
2. 中国船舶重工集团公司第七二五研究所,洛阳,471039 |
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| 基金项目： | 国家科技支撑计划，河南省科技攻关项目 |
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| 摘 要： | 使用搭接面积为1mm2的单搭接钎焊接头,研究了恒定温度下应力对Ag颗粒增强SnCu基复合钎料钎焊接头蠕变寿命的影响,结果表明:Ag颗粒增强SnCu基复合钎料的蠕变抗力优于99.3Sn0.7Cu基体钎料;随着应力的增大,复合钎料及其基体钎料钎焊接头的蠕变寿命均呈下降趋势,且应力对复合钎料钎焊接头蠕变寿命的影响比基体钎料明显.
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| 关 键 词： | 材料科学基础学科 蠕变寿命 复合钎料 应力 |
| 收稿时间： | 2008-02-18 |
| 修稿时间： | 2008-06-01 |
The influence of stress on creep behavior of Ag particle enhancement SnCu based composite solder |
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| YAN Yanfu,XU Jian,GUO Xiaoxiao,FENG Lifang,ZHAO Peifeng.The influence of stress on creep behavior of Ag particle enhancement SnCu based composite solder[J].Chinese Journal of Materials Research,2009,23(1):69-72. |
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| Authors: | YAN Yanfu XU Jian GUO Xiaoxiao FENG Lifang ZHAO Peifeng |
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| Affiliation: | 1.Henan Key Laboratory of Advanced Non-Ferrous Metals, Luoyang 471003
2.725 Graduate School of China Shipping Heavy Industry Group Company, Luoyang 471039 |
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| Abstract: | Single shear lap creep specimens were developed using Ag particle-enhancement SnCu based composite solder to examine the influence of stress on creep behavior of the composite solder in this paper. Results show that the creep resistance of solder joints of particle enhancement 99.3Sn0.7Cu based composite solder is superior to that of 99.3Sn0.7Cu solder joints. At the same time, the creep rupture lifetime of the solder joints of the composite solders was decreased with the increasing of stresses and felt down faster than those of 99.3Sn0.7Cu solder joints. |
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| Keywords: | foundational discipline in materials science creep rupture lifetime composite solder stress |
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