某EBGA器件的失效分析

文中针对某一批次失效率较高的增强型球栅阵列(Enhanced Ball Grid Array,EBGA)器件进行了失效分析。根据产品的失效现象,假设EBGA器件失效由焊接原因或器件本身的质量问题引起,进行了焊接温度检测、焊点外貌检查、X射线检测、红墨水浸渍实验、重回流实验和重植球再焊实验。此系列实验证明该批次EBGA器件的失效并非由虚焊和"混合焊"等焊接原因引起。在上述实验结果(证明EBGA器件焊接可靠)基础上,进一步通过EBGA更换实验,证明该批次EBGA器件失效是由器件本身的质量问题引起的。

Failure Analysis for Some EBGA Devices

Some batch of enhanced ball grid array （EBGA） devices with a high failure rate is analyzed in this paper. According to the failure phenomena of the products, it is assumed that the failures are caused by the welding problems or the quality problems of EBGA devices. The assumption that the product failures are caused by the welding problems of pseudo soldering and mixed soldering is proved unestablished by six experi- ments （the welding temperature detection, the solder joint appearance inspection, the X-ray detection, the red ink dipping experiment, the re-reflow experiment and the reball EBGA re-welding experiment）. The experi- ment results show the EBGA device welding is reliable. Then the EBGA replacement experiment is carried out, which proves that the product failures are caused by the quality problems of EBGA devices.