| 微蚀与混合金属OSP |
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| 引用本文： | 廖贵圣,刘政. 微蚀与混合金属OSP[J]. 印制电路信息, 2010, 0(Z1): 56-60 |
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| 作者姓名： | 廖贵圣 刘政 |
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| 作者单位： | 昆山市贝加尔电子材料有限公司 |
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| 摘 要： | 文章介绍了混合金属基板OSP及选择合适的微蚀剂能有效抑制贾凡尼效应,防止因贾凡尼效应而引起的品质隐患,杜绝金面变色;同时介绍了不同微蚀体系对可焊性影响。
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| 关 键 词： | 微蚀 邮寄可焊性保护剂 焊锡浸润性 混合金属 |
Micro-etching and compound metal OSP |
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| LIAO Gui-sheng,LIU Zheng. Micro-etching and compound metal OSP[J]. Printed Circuit Information, 2010, 0(Z1): 56-60 |
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| Authors: | LIAO Gui-sheng LIU Zheng |
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| Affiliation: | LIAO Gui-sheng LIU Zheng |
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| Abstract: | This article describes the OSP for mixed-metal finishes and chooses a suitable micro-etching, which can prevent quality risks caused by Galvanic effect and prevent gold surface discoloration. And it also describes the different Micro-etching effect on the solderability. |
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| Keywords: | microetch OSP Solderability mixed-metal |
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