| Ni-Cu-P化学镀工艺及组织结构的研究 |
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| 引用本文： | 于会生,罗守福,王永瑞. Ni-Cu-P化学镀工艺及组织结构的研究[J]. 材料工程, 2001, 0(2): 30-33 |
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| 作者姓名： | 于会生 罗守福 王永瑞 |
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| 作者单位： | 上海交通大学材料科学与工程学院，上海 200030 |
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| 基金项目： | 国家九五科学仪器科技攻关资助项目!96 -A2 3-0 5 -0 1 |
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| 摘 要： | 研究了Ni-Cu-P化学镀液主要成分、PH值、温度以及时间等工艺参数对化学沉积Ni-Cu-P合金镀层成分及镀速的影响。通过选择适当的镀液成分及工艺参数，得到了Cu含量从0到56．18wt%的Ni-Cu-P合金镀层。利用EDS和XRD研究了镀液中硫酸铜浓度对Ni-Cu-P合金镀层组织结构的影响。在硫酸铜浓度低于3g/L时，Ni-Cu-P合金镀层中P含量高于7．05wt%，合金镀层是非晶态结构。
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| 关 键 词： | 化学沉积 工艺 组织结构 镍铜磷合金镀层 化学镀 |
| 文章编号： | 1001-4381(2001)02-0030-04 |
| 修稿时间： | 2000-04-13 |
The Technology and Microstructure of Electroless Ni-Cu-P Deposits |
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| YU Hui-sheng,LUO Shou-fu,WANG Yong-rui. The Technology and Microstructure of Electroless Ni-Cu-P Deposits[J]. Journal of Materials Engineering, 2001, 0(2): 30-33 |
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| Authors: | YU Hui-sheng LUO Shou-fu WANG Yong-rui |
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| Abstract: | WT5BZ]The effects of the deposition parameters such as bath composition, PH, temperature and time on the element contents and deposition rate of the electroless Ni Cu P deposits were studied The electroless Ni Cu P deposits with various copper contents from 0 to 56 18 wt% were prepared through choosing the proper deposition parameters The effect of copper sulfate concentration in the bathon the microstructure of the electroless Ni Cu P deposits was studied by using EDS and XRD Ni Cu P deposits with phosphorus content more than 7 05wt% were amorphous, in the situation, the copper sulfate concentration in the bath was lower than 3g/L |
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| Keywords: | electroless Ni Cu P alloys technology microstructure |
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