| 模具半导体激光强韧化工艺研究 |
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| 引用本文： | 闵大勇,王爱华,熊志红,卢飞星.模具半导体激光强韧化工艺研究[J].激光技术,2012,36(3):364-367. |
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| 作者姓名： | 闵大勇 王爱华 熊志红 卢飞星 |
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| 作者单位： | 1.华中科技大学 材料科学与工程学院 武汉 430074; |
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| 摘 要： | 为了研究模具材料半导体激光表面强韧化工艺,采用半导体激光表面淬火工艺,进行了7CrSiMnMoV,Cr12MoV,CrMo铸铁等典型模具材料半导体激光淬火的工艺研究,得到了不同模具材料优化的激光工艺参量。结果表明,激光表面淬火后的硬度满足模具材料的使用要求。这一结果为激光模具表面强韧化处理提供了可靠的保障。
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| 关 键 词： | 激光技术 半导体激光 模具 激光淬火 |
| 收稿时间： | 2011/8/4 |
Process research of diode laser surface hardening for dies |
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| MIN Da-yong
,
WANG Ai-hua
,
XIONG Zhi-hong
,
LU Fei-xing.Process research of diode laser surface hardening for dies[J].Laser Technology,2012,36(3):364-367. |
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| Authors: | MIN Da-yong WANG Ai-hua XIONG Zhi-hong LU Fei-xing |
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| Affiliation: | 1.School of Materials Science and Engineering,Huazhong University of Science and Technology,Wuhan 430074,China;2.Huagong Laser Engineering Co.Ltd.,Wuhan 430223,China) |
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| Abstract: | In order to improve the surface hardness and toughness of dies, several typical die materials, such as 7CrSiMnMoV, Cr12MoV, CrMo cast iron, were hardened with a high power diode laser and the optimal laser parameters were obtained. Results show that the optimal laser parameters can meet the requirement of the hardness of dies and provide a guarantee to the hardness and toughness of dies in future application. |
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| Keywords: | laser technique diode laser die laser quenching |
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