| Abstract: | In order to reduce the internal stress in a cured epoxy resin, the submicron polymer particles were dispersed therein prior to curing. For this purpose, four kinds of poly(butyl acrylate), poly(methyl methacrylate) core-shell particles were prepared by seeded emulsion polymerization for methyl methacrylate with poly(butyl acrylate) seed particles having different particle diameter, and subsequently were powdered by drying at room temperature. It was observed by SEM that poly(butyl acrylate) particles as core were dispersed in the cured epoxy matrix. Poly(methyl methacrylate) as shell seems to dissolve in the matrix. The internal stress of cured epoxy resin decreased with the modification of the particles and the tendency was enhanced with a decreasing in the particle diameter. |
