| 基于COMSOL的感应耦合等离子体刻蚀机流体模型 |
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| 引用本文： | 程嘉,季林红,朱煜,史翊翔.基于COMSOL的感应耦合等离子体刻蚀机流体模型[J].半导体学报,2010,31(3):032004-6. |
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| 作者姓名： | 程嘉 季林红 朱煜 史翊翔 |
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| 作者单位： | State;Laboratory;Tribology;Tsinghua;University;Department;Thermal;Engineering; |
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| 摘 要： | 流体动力学模型被广泛地用于感应耦合等离子体（ICP）的仿真，即使连续性方程在这样低的压力下通常会被认为是不适用的。本课题模拟了一个真实的充满氩等离子体的ICP刻蚀机。本模拟基于一个多物理场仿真软件——COMSOL，一种偏微分方程求解器。正如其他的等离子体流体模型所示，在本模型中用漂移扩散近似描述离子，对电子运动用准中性假设，用简化的Maxwell方程计算电磁场，用电子能量方程求解电子温度，用Navier-Stokes方程来描述中性背景气体。本文展示了在功率200W和气压1.33Pa（10 mTorr）条件下的2维等离子体参数分布情况。进而对比了电子数密度和电子温度随功率的变化。我们确信在预测值与真实值之间存在不一致情况，造成这种差异的原因主要是电子能量分布函数（eedf）的麦克斯韦假设以及对碰撞截面和反应速率的缺失。
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| 关 键 词： | 电感耦合等离子体 流体模型 刻蚀机 麦克斯韦方程组 Stokes方程 流体动力学模型 等离子体参数 电子运动 |
Fluid model of inductively coupled plasma etcher based on COMSOL |
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| Cheng Ji,Ji Linhong,Zhu Yu and Shi Yixiang.Fluid model of inductively coupled plasma etcher based on COMSOL[J].Chinese Journal of Semiconductors,2010,31(3):032004-6. |
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| Authors: | Cheng Ji Ji Linhong Zhu Yu and Shi Yixiang |
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| Affiliation: | State Key Laboratory of Tribology, Tsinghua University, Beijing 100084, China;State Key Laboratory of Tribology, Tsinghua University, Beijing 100084, China;State Key Laboratory of Tribology, Tsinghua University, Beijing 100084, China;Department of Thermal Engineering, Tsinghua University, Beijing 100084, China |
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| Abstract: | Fluid dynamic models are generally appropriate for the investigation of inductively coupled plasmas.A commercial ICP etcher filled with argon plasma is simulated in this study.The simulation is based on a multiphysical software,COMSOL~(TM),which is a partial differential equation solver.Just as with other plasma fluid models,there are drift-diffusion approximations for ions,the quasi-neutrality assumption for electrons movements,reduced Maxwell equations for electromagnetic fields,electron energy equations ... |
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| Keywords: | inductively coupled plasma simulation COMSOL |
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