| 典型添加元素对Sn-Zn系钎料性能的影响 |
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| 引用本文： | 位松,许章亮,李望云,李欣霖,尹立孟. 典型添加元素对Sn-Zn系钎料性能的影响[J]. 重庆科技学院学报(自然科学版), 2011, 0(2): 93-95 |
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| 作者姓名： | 位松 许章亮 李望云 李欣霖 尹立孟 |
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| 作者单位： | 重庆科技学院; |
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| 基金项目： | 重庆市教委科学技术研究项目(KJ101404); 重庆科技学院大学生科技创新训练计划项目 |
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| 摘 要： | Sn-Zn钎料被认为是传统Sn-Pb共晶钎料的最佳替代合金之一,它以低廉的成本、较好的力学性能以及其共晶成分与Sn-37Pb钎料熔点相近等优点引起了人们的广泛关注,但其润湿性、抗氧化性、抗腐蚀性不够理想.阐述了Bi、A1、In、Ag、Cu及稀土元素(RE)等典型添加元素对Sn-Zn钎料各种性能的影响,以期为Sn-Zn钎...
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| 关 键 词： | 电子封装 Sn-Zn 添加元素 性能 |
Influence of Typical Additions on the Properties of Sn-Zn Solder |
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| WEI Song XU Zhang-liang LI Wang-yun LI Xin-ling YIN Li-meng. Influence of Typical Additions on the Properties of Sn-Zn Solder[J]. Journal of Chongqing University of Science and Technology:Natural Science Edition, 2011, 0(2): 93-95 |
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| Authors: | WEI Song XU Zhang-liang LI Wang-yun LI Xin-ling YIN Li-meng |
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| Affiliation: | WEI Song XU Zhang-liang LI Wang-yun LI Xin-ling YIN Li-meng(Chongqing University of Science and Technology,Chongqing 401331) |
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| Abstract: | Sn-Zn solder is one of the most promising alloys as replacement of the conventional Sn-Pb solder with the advantages of acceptable cost,good properties and low eutectic melting point near to Sn-37Pb solder.However,the oxidation resistance,corrosion resistance and wetting properties of Sn-Zn solder are not good.In this paper,it reviews the influence of typical additions(i.e.,Bi,A1,In,RE,Ag and Cu) on the properties of Sn-Zn solder,and proposes some reference for further development and application of Sn-Zn l... |
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| Keywords: | electronic packaging Sn-Zn solder addition property |
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