Wafer-level fabrication process for fully encapsulated micro-supercapacitors with high specific energy |
| |
Authors: | Hugo Durou David Pech David Colin Patrice Simon Pierre-Louis Taberna Magali Brunet |
| |
Affiliation: | 1.CNRS, LAAS, Université de Toulouse,Toulouse,France;2.Université de Toulouse, Université Paul Sabatier, CIRIMAT, UMR CNRS 5085,Toulouse,France |
| |
Abstract: | In this paper a wafer-level process is proposed to fully integrate carbon-based micro-supercapacitor onto silicon substrate. This process relies on the deposition of a paste containing carbon, PVDF and acetone into cavities etched in silicon. After electrolyte deposition in a controlled atmosphere, a wafer-level encapsulation is realized. Cyclic voltammetry performed on non-encapsulated micro-components showed specific energy of 257 mJ cm−2 for 336 μm deep cavities. The specific encapsulation process developed was tested separately and proved to be efficient in terms of resistance to organic electrolytes and mechanical strength. |
| |
Keywords: | |
本文献已被 SpringerLink 等数据库收录! |
|