SiC_p／Cu复合材料的高温磨损行为

研究了SiC颗粒增强铜基复合材料的高温摩擦磨损行为。结果表明,复合材料的磨损量变化受环境温度的影响。当 不超过300℃时,随着温度增加,复合材料的磨损率反而降低。高温磨损过程中,在两接触面间的区域通过机械混合→研 磨→铜基体压入→热压的机制,而在复合材料磨损表面形成一个致密且连续分布的釉质层,对复合材料起到保护作用。当 温度高于临界值时,由于亚表层Cu基体塑性变形量增加,导致釉质层脱落,而发生严重的粘着磨损,使得复合材料的磨损 率显著增加。

Elevated temperature wear behavior of SiCp/Cu composite

The elevated temperature wear behavior of SiCp/Cu composite has been investigated The results show that the variation of wear loss was affected by the environmental temperature. When it was not higher than 300 ℃, the wear rate decreased with the increase of temperature. A protective glaze layer was formed on the worn surface of the composite by the mechanism of mechanically mixing→milling→extrusion of Cu matrix→hot pressing. When it was higher than the critical temperature, the plastic deformation of the subsurface Cu matrix would increase, thus resulting in the delamination of the glaze layer. Therefore, severe adhesive wear occurred and the wear rate increased dramatically.