| 声像分析在系统级封装和多芯片模块检测中的应用 |
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| 引用本文： | 汤姆.亚丹斯. 声像分析在系统级封装和多芯片模块检测中的应用[J]. 电子元件与材料, 2007, 26(8): 59-61 |
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| 作者姓名： | 汤姆.亚丹斯 |
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| 作者单位： | Sonoscan, Inc. 2140E Pratt Blvd Elk Grove Village, IL 60007, USA |
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| 摘 要： | 用反射模式的超声波显微镜对系统级封装SIP和多芯片MCM封装模块的品质进行了研究。探测封装内部的分层、裂纹和气泡等间隙类缺陷。用超声探测转换器把脉冲超声波送入样品,同一个转换器把接收到的回声转换成像点。最大的反射振幅是从固体与气体间的界面产生的。在固体材料内部,分层、孔洞及裂纹会造成最大振幅的回声并可以成像。超声波显微镜可发现SIP和MCM样品内间隙类的缺陷分层裂纹和气泡。
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| 关 键 词： | 电子技术 超声波显微镜 分层 裂纹 气泡 超声转换器 多芯片模块检测 |
| 文章编号： | 1001-2028（2007）08-0059-03 |
| 修稿时间： | 2007-03-13 |
Application of acoustic image analysis in system-in-package and multi-chip modules detection |
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| Tom Adams. Application of acoustic image analysis in system-in-package and multi-chip modules detection[J]. Electronic Components & Materials, 2007, 26(8): 59-61 |
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| Authors: | Tom Adams |
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| Affiliation: | Sonoscan, Inc.2140E Pratt Blvd Elk Grove Village, IL 60007, USA |
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| Abstract: | The packaging integrity of system-in-package configurations(SIP) and of multi-chip modules(MCM) was investigated using reflection-mode acoustic microscopy.Any internal packaging defects such as delaminations,cracks and voids were identified and characterized.Reflection-mode acoustic microscopy uses an ultrasonic transducer that pulses ultrasound into the sample and receives the return echoes,which was converted into pixels.The highest-amplitude return echoes come from interfaces between a solid material and a gas such as air,delaminations,voids and cracks therefore have high-amplitude echoes and can be imaged through solid materials.Acoustic microscopy revealed gap-type defects(delaminations,cracks and voids) in the SIP and MCM samples. |
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| Keywords: | electron technology acoustic microscopy delamination voids ultrasonic transducer detection of MCM |
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