用低温圆片键合实现传感器和微电子机械系统器件的集成和封装

集成化是传感器和微电子机械系统(MEMS)的发展方向,即将传感功能、逻辑电路和驱动功能集成在一块单芯片上。未来的系统芯片将能通过集成的传感器和逻辑电路收集并分析外界数据,将这些数据传输到中央处理器并产生必要的动作或反应。讨论了这种系统集成芯片对于封装和集成的要求,并提出一种能够满足这种要求的低温键合技术。同时这种低温键合技术还具有气密性封装、保留透明窗口等优点。

Integration and Packaging of Sensors and MEMS Devices Through Low Temperature Wafer Bonding

Sensors and MEMS roadmaps now point toward integration;sensing capabilities,logic,and actuation all integrated in one single device.A future system will consist of sensing elements connected to logic functions that can collect data,analyze the data and either pass the information on to central units or determine the appropriate action?reaction necessary.Key requirements for packaging and integration of such devices will be addressed and solutions provided that would allow for low temperature packaging and integration.These solutions will simultaneously fulfill various other requirements imposed by the function or function principle of the sensor or MEMS device such as transparency or hermetic sealing.