| 甲磺酸盐光亮镀锡铅合金工艺研究 |
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| 引用本文： | 王爱荣,荆瑞俊,亓新华,陶建中. 甲磺酸盐光亮镀锡铅合金工艺研究[J]. 表面技术, 2003, 32(3): 55-56 |
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| 作者姓名： | 王爱荣 荆瑞俊 亓新华 陶建中 |
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| 作者单位： | 河南职业技术师范学院,河南,新乡,453003;河南职业技术师范学院,河南,新乡,453003;河南职业技术师范学院,河南,新乡,453003;河南职业技术师范学院,河南,新乡,453003 |
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| 摘 要： | 研究了甲磺酸体系光亮镀锡铅合金工艺中各因素对镀层质量的影响，同时对镀锡铅合金的厚度、施镀阻挡层对镀层可焊性的影响作了阐述。
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| 关 键 词： | 镀合金 锡铅合金 甲磺酸盐 可焊性 |
| 文章编号： | 1001-3660(2003)03-0055-02 |
Study on Technology of Bright Sn-Pd Acid Alloy Electroplating in Methanesulfonic Acid |
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| WAN Ai rong,JING Rui jun,QI Xin hua,TAO Jian zhong. Study on Technology of Bright Sn-Pd Acid Alloy Electroplating in Methanesulfonic Acid[J]. Surface Technology, 2003, 32(3): 55-56 |
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| Authors: | WAN Ai rong JING Rui jun QI Xin hua TAO Jian zhong |
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| Abstract: | In this article the effects of vanious factors in the technology of bright Sn Pd alloy electroplating in me thanesulfonic acid on the electroplating quality are discussed. At the same time ,in this article the thickness of the Sn Pd alloy and the effect of electroplating countercheck layer on electroplating welding capability are also stated. |
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| Keywords: | Sn-Pd alloy electroplating Methanesulfonic acid Welding capability |
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