| 铜与铝软钎焊技术的研究现状 |
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| 引用本文： | 吴伟明,高岩.铜与铝软钎焊技术的研究现状[J].印制电路信息,2008(3):65-68,70. |
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| 作者姓名： | 吴伟明 高岩 |
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| 作者单位： | 江西理工大学材料与化学工程学院,江西,赣州,341000 |
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| 摘 要： | 综述了近年来铜与铝软钎焊在钎焊方法、钎料及钎剂三个方面的技术发展现状，指出铜铝软钎焊的技术优势以及铜与铝软钎焊技术应用前景广阔。
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| 关 键 词： | 钎焊 锏与铝 钎料 钎剂 |
| 文章编号： | 1009-0096(2008)03-0065-04 |
Present Situation of Research on Soldering Technique of Copper and Aluminum |
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| WU Wei-ming,GAO Yan.Present Situation of Research on Soldering Technique of Copper and Aluminum[J].Printed Circuit Information,2008(3):65-68,70. |
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| Authors: | WU Wei-ming GAO Yan |
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| Affiliation: | WU Wei-ming GAO Yan |
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| Abstract: | The present situation of soldering on soldering technology, filler metal and flux of copper and aluminum is described. Technical superiority of the copper and aluminum soldering is pointed out. As well as application prospect of the copper and aluminum soldering technology is broad. |
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| Keywords: | soldering copper and aluminum filler material flux |
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