Low-temperature fabrication of p+-n diodes with300-Å junction depth |
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Authors: | Weiner K.H. Carey P.G. McCarthy A.M. Sigmon T.W. |
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Affiliation: | Lawrence Livermore Nat. Lab., Livermore, CA; |
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Abstract: | Gas immersion laser doping (GILD) was used to fabricate p+ -n diodes with 300-Å junction depth. These diodes exhibit ideality factors of 1.01-1.05 over seven decades of current, reverse leakage current densities ⩽10 nA/cm2 at -5-V reverse bias, breakdown voltages above 100 V, and electrical activation of the boron impurity to concentrations approaching 1×1021 atoms/cm3. This behavior is achieved without the use of a furnace or rapid thermal anneal |
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