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硅对铝铅轴承合金带与热浸铝钢板热轧复合界面强度的影响
引用本文:刘勇兵,安健,陆有,孙大仁,杨波.硅对铝铅轴承合金带与热浸铝钢板热轧复合界面强度的影响[J].复合材料学报,2002,19(1):22-27.
作者姓名:刘勇兵  安健  陆有  孙大仁  杨波
作者单位:吉林大学,南岭校区,材料科学与工程学院,长春,130025
基金项目:教育部博士点基金项目 ( 19990 185 13)
摘    要:将铝铅合金带分别与热浸纯Al、Al-2%Si合金的钢板进行热轧复合。研究了元素硅、热浸时间、金属间化合物层厚度及缺口界面分数对结合强度的影响。结果表明,在复合过程中产生两种不同界面,铝铅合金与热浸铝钢板通过缺口界面和化合物界面而结合。总的结合强度主要取决于缺口界面强度的大小与分数的高低,而且与后者之间呈线性关系。硅对总结合强度的影响体现在:虽然对化合物界面强度的影响较小,但显著提高缺口界面强度,因而使总结合强度明显提高。在给定实验条件下,使热浸纯Al时的缺口界面强度从约为化合物界面强度的4倍提高到热浸Al-2%Si时的近6倍。

关 键 词:金属间化合物  结合强度  缺口界面  化合物界面
文章编号:1000-3851(2002)01-0022-06
收稿时间:2000-05-12
修稿时间:2000年5月12日

EFFECT OF Si ON THE INTERFACIAL BONDING STRENGTH OF Al-Pb ALLOY STRIPS AND HOT DIP ALUMINIZED STEEL SHEETS BY HOT ROLLING
LIU Yong-bing,AN Jian,LU You,SUN Da-ren,YANG Bo.EFFECT OF Si ON THE INTERFACIAL BONDING STRENGTH OF Al-Pb ALLOY STRIPS AND HOT DIP ALUMINIZED STEEL SHEETS BY HOT ROLLING[J].Acta Materiae Compositae Sinica,2002,19(1):22-27.
Authors:LIU Yong-bing  AN Jian  LU You  SUN Da-ren  YANG Bo
Affiliation:School of Materials Science and Engineering, Jilin University Nanling Compus, Changchun 130025, China
Abstract:Bonding of Al- Pb alloy strips and hot dipped Al or Al- 2 % Si steel sheets was carried out by using hotrolling.The effectsofaddition of2 % Sito the bath,dipping time,thicknessofthe inter- metallic layers and fraction of blank interfaces on bonding strength are investigated.In allcases,two different kinds of interfaces are produced;hot dip aluminized steel sheets and Al- Pb alloy strips are bonded through a mechanism of the blank and block interface bonding.The total bonding strength mainly depends on thatof blank interface and the fraction ofblank interfaces,and there isa linear re- lationship between the bonding strength and fraction of blank interfaces.The effectof Si on the total bonding strength represents the factthat though it has little effect on the bonding strength of block interface,it enormously increases the bonding strength of blank interface so that the total bonding strength grows much higher evidently.Under the given experimental conditions,it increases the bonding strength of blank interfacessix times ashigh asthatof block interfacesforhotdipped Al- 2 Si specimens in contrastwith four times as high as thatfor hotdipped Al specimens.
Keywords:intermetallic compound  bonding strength  block interface  blank interface
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