| 适于SMT的微波混合集成电路制造工艺 |
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| 引用本文： | 刘刚,汤俊.适于SMT的微波混合集成电路制造工艺[J].电子工艺技术,1998,19(5):190-192. |
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| 作者姓名： | 刘刚 汤俊 |
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| 作者单位： | 电子部１４所 |
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| 摘 要： | 通过对微波混合集成电路采用ＳＭＴ进行批生产的前提条件－薄膜电路的焊接性能进行了理论分析和实验研究，得出了铜薄膜体系工艺最适于满足ＳＭＴ要求的微波混合集成电路的制作，并给出了制作实例。
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| 关 键 词： | SMT 薄膜电路 耐焊性 混合集成电路 制造工艺 |
Manufacturing Technology of MHlC-Suitable for SMT |
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| Liu Gang Tang Jun Jia Shancheng Wang Tingyue.Manufacturing Technology of MHlC-Suitable for SMT[J].Electronics Process Technology,1998,19(5):190-192. |
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| Authors: | Liu Gang Tang Jun Jia Shancheng Wang Tingyue |
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| Affiliation: | Liu Gang Tang Jun Jia Shancheng Wang Tingyue |
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| Abstract: | In this paper,Soldering property of MHIC is analyzed from theory and studied from experiment,Which is essential prerequisite for batch-production of MHIC with the aid of SMT.It is found that Cu-based technology(Cr Au Cu Au)is most suitable for manufacturing MHIC to meet the demands of SMT,and practical example of this technology is also given. |
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| Keywords: | SMT Soldering resistance of thin film integrated circuit MHlC-Microwave hybrid integrated circuit |
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