| 基于MSP430系列单片机的感应加热系统 |
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| 引用本文： | 杨杰,乔俊力,丁友涛.基于MSP430系列单片机的感应加热系统[J].电子世界,2012(16):40-41. |
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| 作者姓名： | 杨杰 乔俊力 丁友涛 |
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| 作者单位： | 兖州东方机电有限公司 |
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| 摘 要： | 系统使用MSP430系列单片机控制驱动电路和产生PWM脉冲,同时实现感应加热系统的软启动功能。并且对IGBT温度、电流进行检测,根据保护信号及时做出响应防止IGBT因过流、过热而损坏。另外,结合注塑机的特点,注塑机温度稍高会导致料筒的原料被烧糊,所以用K型热电偶和MAX6675芯片检测料筒温度将其反馈到单片机,给感应加热加入PID调节来控制料筒温度。
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| 关 键 词： | MSP430单片机 IGBT 驱动模块 PID |
Induction Heating System Based on MSP430MCU |
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| Affiliation: | Wu Jian-hua, Chen Wei-min, Wang zhao-yong ( School of Mechanical and Electrical Engineering, Shandong University at Weihai, Weihai, 264209 ) |
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| Abstract: | The system can generate and control the driving circuit to produce PWM pulses and achieve the goal of soft-start of the heating system.We also detect the temperature and current of IGBT to take effective steps to protect IGBT.Moreover, measure the temperature of cylinder with K-type thermocouple and give it back to MCU, then using PID m control the temperature. |
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| Keywords: | MSP430MCU IGBT Drive module PID |
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