基于新型纳米复合介电材料的嵌入式微电容制备及特性

嵌入式微电容技术是一种能够使电子器件微型化,并提高其性能及可靠性的方法.研究适用于嵌入式环境的高介电材料,有着重要的意义.采用粒径为92 nm的钛酸钡（BaTiO3）颗粒作为纳米无机填充颗粒,选用聚酰亚胺（PI）作为有机基体制备新型BaTiO3/PI纳米复合薄膜,并对该薄膜的介电性能、耐压特性及温度特性进行了测试;并采用光刻、溅射、刻蚀等工艺,对BaTiO3/PI纳米复合薄膜进行图形化研究,制造嵌入式微电容器件原型,其后对该器件的介电性能进行了测试.测试结果显示,嵌入式电容器件原型的介电常数在低频下达到15以上,击穿场强达到58 MV/m以上,而刻蚀和溅射工艺对薄膜的性能影响不大.

Fabrication and Characterization of Embedded Capacitors Based on Novel Nanocomposite as Dielectric Materials

Embedded capacitor technique is an approach to miniaturizing electronic devices and enhancing their performance and reliability. Therefore, it is of great importance to study high dielectric materials that can be used in embedded environment. In this paper, barium titanate (BaTiO3) particles with average size of 92 nm were used as inorganic nano-fillers and polyimide (PI) was adopted as matrix to fabricate the novel BaTiO3/PI nanocomposite dielectric films, whose dielectric properties, electric breakdown strength and temperature properties were tested. The film was patterned, sputtered and etched to fabricate a prototype embedded capacitor, dielectric properties of which were also tested. Test results indicate that the prototype embedded capacitor has dielectric permittivity higher than 15 at low frequency and electric breakdown strength above 58 MV/m, and etching and sputtering have little impact on the films dielectric properties.