| 金银钯及其合金在含Cr^6＋试剂中的金相侵蚀行为 |
| |
| 引用本文： | 许昆.金银钯及其合金在含Cr^6＋试剂中的金相侵蚀行为[J].理化检验(物理分册),1999,35(7):308-309. |
| |
| 作者姓名： | 许昆 |
| |
| 作者单位： | 昆明贵金属研究所 昆明650221 |
| |
| 摘 要： | 采用含有Ｃｒ＾６＋的酸性溶液和擦试法可去除金，银，钯及其合金相样品表面的变形层和划痕，用相同的试剂配方采用浸泡法同时可显示金相组织。实现了一种试剂同时谐有抛光和显示组织的作用，是一种制备高质量金相样品的有效方法。
|
| 关 键 词： | 金基合金 银基合金 钯基合金 金相技术 试剂 |
THE METALLOGRAPHIC ETCHING BEHAVIOR OF GOLD SILVER PALLADIUM AND THEIR ALLOYS IN Cr(?)-CONTAINING SOLUTIONS |
| |
| Xu KunInstitute of Precious Metals Kunming.THE METALLOGRAPHIC ETCHING BEHAVIOR OF GOLD SILVER PALLADIUM AND THEIR ALLOYS IN Cr(?)-CONTAINING SOLUTIONS[J].Physical Testing and Chemical Analysis Part A:Physical Testing,1999,35(7):308-309. |
| |
| Authors: | Xu KunInstitute of Precious Metals Kunming |
| |
| Affiliation: | Xu KunInstitute of Precious Metals Kunming |
| |
| Abstract: | By swabing with, or immersion in acid solutions of HC1, H2SO4, HNO3 and their mixtures con-taining Cr~(-6) ion, deformation layer on the surface of Gold, Silver, Palladium and their alloy specimen can be re-moved, and grain boundary be revealed successfully. |
| |
| Keywords: | Gold base alloy Silver base alloy Palladium base alloy Metallographic etching |
| 本文献已被 CNKI 维普 等数据库收录！ |
