In对SnBiAg焊料微观结构及力学性能的影响

使用电磁感应加热炉制备Sn-35Bi-0.3Ag-x In低温无铅焊料，采用X射线衍射仪(XRD)、扫描电子显微镜(SEM)、能谱仪(EDS)、万能拉伸试验机、维氏硬度仪，研究添加In元素对焊料的物相、组织结构、机械性能的影响。结果表明，添加In元素固溶到焊料基体中，细化了焊料组织结构。合金焊料的抗拉强度也随着In元素含量的增加而增大。但是其硬度，延展性却随着In元素含量的增加先增加后降低。此外，当添加0.5%含量的In时，析出的Bi相减少，延展性得到提高，焊料的综合力学性能较好。

Effect of In on microstructure and mechanical properties of SnBiAg solders

SnBiAg-xIn, a kind of low temperature lead-free solder, was prepared by electromagnetic induction heating furnace. X-ray diffractometer (XRD), scanning electron microscope (SEM), energy dispersive spectrometer (EDS), universal tensile testing machine and Vickers hardness tester were used to study the effect of In on the phase, microstructure and mechanical properties of the solder. The results show that the addition of In element into the solder matrix can refine the organizational structure of the solder. The tensile strength of the alloy solder increases with the increase of In content, however, the hardness and ductility increase first and then decrease. In addition, when the amount of In is 5% in the solder, the precipitated Bi phase is accordingly reduced, leading to an improvement in the ductility and comprehensive mechanical properties of the solderr.