Flexible Dielectric Bi1.5Zn1.0Nb1.5O7 Thin Films on a Cu-Polyimide Foil |
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| Authors: | Jungho Ryu Kun-Young Kim Jong-Jin Choi Byung-Dong Hahn Woon-Ha Yoon Byoung-Kuk Lee Dong-Soo Park Dae-Yong Jeong Chan Park |
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| Affiliation: | Functional Ceramics Research Group, Korea Institute of Materials Science (KIMS), Changwon, Gyeongnam 641-831, Korea;
Division of Materials Science and Engineering, Pukyong National University, Nam-Gu, Busan 608-739, Korea;
Department of Materials Science and Engineering, Myongji University, Yongin, Gyeonggi 449-728, Korea |
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| Abstract: | Flexible thin films of Bi1.5Zn1.0Nb1.5O7 (BZN) were deposited on a Cu/polyimide (PI) foil by aerosol deposition at room temperature. The BZN film thickness was in the range of 1.2–17.9 μm. Highly dense and nanocrystalline films were obtained without any heat treatment. The dielectric constant and loss of the film at 100 kHz were over 150 and 0.04, respectively. Furthermore, the as-deposited film showed markedly low leakage current densities of <10−9 A/cm2 at 3.0 V. These reasonably high dielectric properties were due to the nanocrystallinity of the films. The results confirm the significant potential of the BZN films as passive components in flexible printed circuit board applications. |
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