| 无铅电子封接玻璃材料性能的改进 |
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| 引用本文： | 蒋文军,李宏杰,卫海民,张志旭. 无铅电子封接玻璃材料性能的改进[J]. 电子元件与材料, 2010, 29(5). DOI: 10.3969/j.issn.1001-2028.2010.05.016 |
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| 作者姓名： | 蒋文军 李宏杰 卫海民 张志旭 |
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| 作者单位： | 西安创联轮德器件有限公司,陕西,西安,710065 |
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| 基金项目： | 国家科技部中小企业创新基金资助项目 |
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| 摘 要： | 为了提高电子器件封接玻璃材料的性能,采用固相烧结法制备了B2O3-ZnO-CaO无铅电子封接玻璃材料,并研究了其成分与性能的关系。结果表明:当w(B2O3)为45%,w(ZnO)为34%,w(CaO)为10%,w(Na2O)为2%,w(K2O)为3%,其他成分为质量分数6%时,可制得一种封接温度低于600℃,tk–100≥300℃,击穿场强≥23×106V/mm,线膨胀系数为≤7.0×10–6,抗折强度在117.65～146.57MPa的低熔点无铅电子封接玻璃材料。
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| 关 键 词： | 无铅电子封接玻璃 B2O3-ZnO-CaO 封接温度 |
Performance improvement of lead-free electronic sealing glass |
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| JIANG Wenjun,LI Hongjie,WEI Haimin,ZHANG Zhixu. Performance improvement of lead-free electronic sealing glass[J]. Electronic Components & Materials, 2010, 29(5). DOI: 10.3969/j.issn.1001-2028.2010.05.016 |
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| Authors: | JIANG Wenjun LI Hongjie WEI Haimin ZHANG Zhixu |
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| Abstract: | To improve the performance of sealing glass for electronic devices,B2O3-ZnO-CaO lead-free electronic sealing glass was prepared by the solid phase sintering method.The effects of the composition of the sealing glass on its performance were studied.The results show that the sealing glass prepared from 45% B2O3,34% ZnO,10% CaO,2% Na2O,3% K2O and 6% other components(mass fraction)is a low-melting lead-free electronic sealing glass with the sealing temperature below 600℃,tk–100 above 300℃,breakdown voltage larger than 23×106 V/mm,linear expansion coefficient smaller than 7.0×10–6 and flexural strength within 117.65～146.57 MPa. |
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| Keywords: | B2O3-ZnO-CaO |
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