| 树脂结合剂含量对单晶硅片减薄加工用砂轮性能的影响规律研究 |
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| 引用本文： | 叶恒,魏昕,陈卓,谢小柱.树脂结合剂含量对单晶硅片减薄加工用砂轮性能的影响规律研究[J].工具技术,2011,45(5):17-20. |
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| 作者姓名： | 叶恒 魏昕 陈卓 谢小柱 |
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| 作者单位： | 广东工业大学; |
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| 基金项目： | 国家自然科学基金资助项目(U0734008); 广东省自然科学基金资助项目(10151009001000036) |
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| 摘 要： | 通过磨削实验,研究了树脂结合剂含量对用于单晶硅片减薄加工的金刚石砂轮的力学特性和磨削性能的影响,对砂轮的硬度、抗压强度、气孔率、磨削比、堵塞现象等进行了对比分析.结果表明,随着树脂结合剂含量增加,砂轮的硬度、抗压强度逐渐增大,气孔率变化不大.在单晶硅片的磨削实验中,随着树脂结合剂含量增加,砂轮的磨削比逐渐增大;树脂结合...
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| 关 键 词： | 树脂结合剂含量 金刚石砂轮 硬度 磨削比 砂轮堵塞 |
Research on Influence of Wheel Performance on Silicon Wafer Thinning by Resin Bond Content |
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| Ye Heng,Wei Xin,Chen Zhuo,Xie Xiaozhu.Research on Influence of Wheel Performance on Silicon Wafer Thinning by Resin Bond Content[J].Tool Engineering(The Magazine for Cutting & Measuring Engineering),2011,45(5):17-20. |
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| Authors: | Ye Heng Wei Xin Chen Zhuo Xie Xiaozhu |
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| Affiliation: | Ye Heng,Wei Xin,Chen Zhuo,Xie Xiaozhu Postgraduate,Faculty of Electromechanical Engineering,Guangdong University of Technology,Guangzhou 510006,China |
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| Abstract: | The influences of resin bond content on the mechanical properties and grinding performances of diamond grinding wheel for the thinning machining of silicon wafers were studied through grinding experiment.The wheel hardness,compressive strength,porosity,grinding ratio and blockage on grinding wheel surface were compared and analyzed.The results show that with the resin bond content increasing,the wheel hardness and compressive strength increased,and the porosity had little changed.In the grinding experiment ... |
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| Keywords: | resin bond content diamond grinding wheel hardness grinding ratio blockage of grinding wheel |
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