| 镁合金触变成形在3C产品壳体上的应用 |
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| 引用本文： | 曾英 罗静. 镁合金触变成形在3C产品壳体上的应用[J]. 重庆理工大学学报(自然科学版), 2006, 20(11): 44-46 |
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| 作者姓名： | 曾英 罗静 |
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| 作者单位： | 重庆工学院材料科学与工程学院 重庆400050 |
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| 摘 要： | 介绍了镁合金的特点和镁合金在电子壳罩生产上的应用状况,将镁合金触变注射成形产品和镁合金压铸产品进行比较,并列举了一些镁合金触变注射成形零件及其主要特点,对镁合金触变注射成形在电子壳罩生产上的市场前景进行了预测.
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| 关 键 词： | 电子壳罩 镁合金触变注射成形 触变注射成形机 |
| 文章编号： | 1671-0924（2006）11-0044-03 |
| 收稿时间： | 2006-07-05 |
| 修稿时间： | 2006-09-15 |
Applications of Magnesium Alloy Thixo-molding Technology in 3C Production |
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| ZENG Ying, LUO Jing. Applications of Magnesium Alloy Thixo-molding Technology in 3C Production[J]. Journal of Chongqing University of Technology(Natural Science), 2006, 20(11): 44-46 |
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| Authors: | ZENG Ying LUO Jing |
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| Affiliation: | School of Material Science and Engineering, Chongqing Institute of Technology, Chongqing 400050, China |
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| Abstract: | This paper introduces the characteristics and applications of Magnesium Alloy Thixo-Molding in electronics enclosures.From the aspects of machine function,surface quality,and corrosion resistance,this paper compares the Magnesium Alloy products produced by Thixo-Molding with the Magnesium Alloy products produced by die-casting,lists some parts and their features made by die-casting,and makes predictions on the market prospects of electronic enclosure production by Magnesium Alloy Thixo-Molding. |
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| Keywords: | electronics enclosures Magnesium Alloy Thixo-Molding Thixo-Molding machine |
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