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Optoelectronic Smart Pixels Comprising Flip-Chip-Bonded GaAs/AIGaAs MQW Detectors and Modulators on Silicon CMOS Circuit
Authors:CHEN Hong-da  LIANG Kun  ZENG Qing-ming  LI Xian-jie  CHEN Zhi-biao  DU Yun  WU Rong-han
Affiliation:1. Institute of Semiconductors,The Chinese Academy of Sciences
2. Institute of Hebei Semiconductors
Abstract:Optoelectronic smart pixels with hybrid integration of GaAs/AlGaAs multiple quantum well (MQW) detectors and modulators arrays have beed made,which are flip-chip bonded directly on the top of lμm silicon CMOS circuits,as enables an achievement of Optoelectronic Integrated Circuits (OEIC) as well as does the design and optimization of CMOS circuits and GaAs/AlGaAs MQW devices to proceed independently.
Keywords:MQW  photodetector  modulator array  CMOS  flip-chip bonding  OEIC  smart Pixels
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