Optoelectronic Smart Pixels Comprising Flip-Chip-Bonded GaAs/AIGaAs MQW Detectors and Modulators on Silicon CMOS Circuit |
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| Authors: | CHEN Hong-da LIANG Kun ZENG Qing-ming LI Xian-jie CHEN Zhi-biao DU Yun WU Rong-han |
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| Affiliation: | 1. Institute of Semiconductors,The Chinese Academy of Sciences
2. Institute of Hebei Semiconductors |
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| Abstract: | Optoelectronic smart pixels with hybrid integration of GaAs/AlGaAs multiple quantum well (MQW) detectors and modulators arrays have beed made,which are flip-chip bonded directly on the top of lμm silicon CMOS circuits,as enables an achievement of Optoelectronic Integrated Circuits (OEIC) as well as does the design and optimization of CMOS circuits and GaAs/AlGaAs MQW devices to proceed independently. |
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| Keywords: | MQW photodetector modulator array CMOS flip-chip bonding OEIC smart Pixels |
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