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Carrier Depth Profile of Si/SiGe/Si n-p-n HBT Structural Materials Characterized by Electrochemical Capacitance-Voltage Method
Authors:LIN Yan-Xia  HUANG Da-ding  ZHANG Xiu-lan  LIU Jin-ping  LI Jian-ping  GAO Fei  SUN Dian-zhao  ZENG Yi-ping  KONG Mei-ying
Affiliation:Materials Science Center, Institute of Semiconductors, The Chinese Academy of Sciences, Beijing 100083, China
Abstract:Si/SiGe/Si n-p-n HBT structural materials have been grown by gas source molecular beam epitaxy with disilane, solid Ge, diborane and phosphine as sources. The materials are of good structural properties. The effectiveness of Electrochemical Capacitance-Voltage (ECV) technique on profiling the shallow doped layers of nanometer dimensions has been demonstrated. Compared with spreading resistance probe, the ECV technique is relatively easy to get the carrier distribution profile, especially for the Si/SiGe/Si HBT structural materials with shallow (≤50nm) base regions (p-type SiGe layer, Ge content about 0.2). The results show that n-p-n structures can be obtained by in situ doping.
Keywords:SiGe HBT  GSMBE  ECV
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