覆Ag层对用于LD封装的In焊料性能的影响

In焊料由于其优越的可塑性以及优良的导电、导热特性,被广泛用于半导体激光器(LD)的封装。但是In焊料遇空气易氧化,尤其在焊接加热的过程中,氧化现象更加明显,因此一般当天制备当天使用。为防止氧化,可以在In焊料表面镀一层Ag或Au作为保护层,因为Ag成本较Au低,可作为首选的保护层。关于In-Ag合金性能的研究已有过相关报道,但关于In-Ag合金的表面形貌及Ag层厚度对内部In的影响的报道还很少。文章通过扫描电子显微镜、XRD对不同样品进行了表面和成分的分析,得到了关于Ag对内部焊料的影响以及不同冷却速率下焊料的表面形貌。

The Effection of Ag Covered Layer on the Performance of Indium Solder for LD Package

Indium solder is wildly used in welding laser diode(LD) due to its excellent plasticity,good electrical conductivity and thermal conductivity properties.Indium solder is oxidized easily in air.Especially in the process of welding,the oxidation phenomenon is more obvious.It’s usually used as the day as it’s prepared1].In order to provent indium solder from oxidation,a layer of Ag or Au is usually plated on the top of indium solder as a protection layer2~3].Consider the cost factor,Ag is the first choice of protection layer.Though the research about the performance of In-Ag alloy has been reported a lot4~9],they concern about surface morphology of In-Ag alloy and the effection of the thickness of Ag layer on internal indium solder little.In this paper,we analyzed surfaces and compositions of different samples through scan electron microscope and X-Ray Diffraction method,get the effection of Ag layer on internal solder and surface morphologies under different cooling rate.