| 锡铜无铅焊料在电路板组装中的应用 |
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| 引用本文： | 蔡克新.锡铜无铅焊料在电路板组装中的应用[J].电子与封装,2012(10):7-9,18. |
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| 作者姓名： | 蔡克新 |
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| 作者单位： | 中国电子科技集团公司第二研究所,太原030024 |
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| 摘 要： | 在无铅组装工艺中,大多数电路板组装厂优先采用低成本焊料合金。没有添加剂的锡铜无铅焊料本身存在局限性,可是添加某种成份后,就能克服锡铜焊料通常所遇到的不足之处。文章分析了几种锡铜焊料相对于SAC焊料的特点,并叙述了它们在波峰焊和手工焊接工艺中的应用情况。
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| 关 键 词： | 无铅工艺 锡铜焊料 波峰焊 手工焊 |
The Application of Tin-Copper Lead-free Solder in PCB Assembly |
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| CAI Kexin.The Application of Tin-Copper Lead-free Solder in PCB Assembly[J].Electronics & Packaging,2012(10):7-9,18. |
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| Authors: | CAI Kexin |
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| Affiliation: | CAI Kexin (China Electronics Technology Group Corporation No.2 Research lnstitute, Taiyuan 030024,China) |
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| Abstract: | first. the the In Lead-free process, a substantial percentage of PCB assemblers select less costly solder alloys at Tin-copper solder without dopants has limitations, but the addition of certain elements helps to eliminate deficiencies normally seen with tin-copper solder. This paper discusses several tin-copper options and advantages they offer when compared with SAC based solder. And introduce how to use them in wave- soldering and hand-soldering process |
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| Keywords: | Lead-free process Tin-copper solder wave soldering hand-soldering |
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