RFIC芯片的测试与设计验证

射频芯片(RFIC)的性能极易受到键合线、外围元件与电路等片外因素的影响,通常一款商用射频芯片的设计需要经过从初始芯片设计、芯片测试验证、修正芯片设计的多轮反复过程。因此射频芯片在设计时就需要对IC电路、键合和片外元件电路进行综合考虑。根据这一特点,结合相关芯片的实践经验,讨论射频芯片测试与验证的一般方法和经验技巧,对RFIC的设计具有实用价值。

The Testing and Verifying Techniques of RFIC Design

It is the bond-wires,off-chip components and circuits consisted of an RFIC on-PCB test-system that could markedly effect on the applied performance of an RFIC chip.For that,the whole design flow of a commercial RFIC chip often consists of several cycles from primary IC design to testing and verifying and then to modification and redesign.Therefore,the on-chip circuits,bond-wires and off-chip components should be considered as an integrated system while designing an RFIC chip.Based on these reasons mentioned above,considering some application experiences,application techniques in RFIC designing,testing and verifying are studied in this paper.This is valuable to guiding any RFIC design.