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PDP器件中介质的制作技术研究
引用本文:王文江,卜忍安,徐伟军.PDP器件中介质的制作技术研究[J].真空电子技术,2000(4):1-4.
作者姓名:王文江  卜忍安  徐伟军
作者单位:西安交通大学电子物理与器件研究所!陕西西安710049
摘    要:本文讨论了对PDP上下基板所用介质层的要求及其浆料选择的原则,研究了丝网印刷、干燥和烧结等工艺对介质层厚度、表面状态、透过率、绝缘性能等的影响,介绍了减小和消除介质层欠点、针孔、气泡等缺陷的措施,确立了一套制作介质层的综合、有效的技术方法。

关 键 词:介质层  软化点  透过率  等离子体器件

Study on Manufacturing Technology of Dielectric Film in PDP
WANG Wen-jiang,BU Ren-an,XU Wei-jun,LU Nai-kang.Study on Manufacturing Technology of Dielectric Film in PDP[J].Vacuum Electronics,2000(4):1-4.
Authors:WANG Wen-jiang  BU Ren-an  XU Wei-jun  LU Nai-kang
Abstract:The requirements for the dielectric layer in PDP and the principle of choosing the pastes to meet these requirements are discussed in this paper.Technology of screen printing,drying and firing have a considerable influence upon the thickness,surface condition,transparency and insulating performances.The methods are introduced by which we can reduce or eliminate the defects such as blemish,pin hole and air bubble.A set of comprehensive and effective technology of manufacturing dielectric layer has been established.
Keywords:Dielectric film  Soft point  Transmission coefficient
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