双层热源双层通道内流体流动与传热特性

为了应对集成电路中日益严峻的热问题,数值模拟了双层热源双层微通道结构内流体的流动及传热特性,将其与单层热源单层微通道进行对比分析,发现上下通道层之间的相互影响使得上层通道加热面温度降低2℃左右,下层通道热阻减小10%左右.而后以减小对流热阻的角度出发,对整体结构的传热性能进行优化,在原有矩形通道基础上布置圆形针肋以及扇形凹穴,发现此种新型通道使得下层加热面温度降低11℃左右,热阻减小,系统性能提高.

Flow and Heat Transfer Characteristics in Double-layer Channel With Double Heat Sources

To deal with the increasingly severe thermal issues in integrated circuit, the flow and heat transfer characteristics of the fluid in the double-layer channel which have double-layer heat source were numerically simulated,and the results were compared to the single channel which has single heat source. Due to the interaction between the two channel layers,the heat source temperature of the upper channel and the thermal resistance of the lower channel were reduced by about 2℃ and 10%,respectively. The heat transfer performance was optimized by reducing convective thermal resistance. Micro-pin fin and fan-shaped reentrant cavities were arranged on the original rectangular channel structure. Results show that the heat source temperature of the lower channel is reduced about 11℃ by the new channel. The thermal resistance is reduced and the system performance is improved.